학술논문
Co-simulation and co-design of chip-package-board interfaces in highly-integrated RF systems
Document Type
Conference Paper
Author
Source
In: Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting , 2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, BCTM 2016. (Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting, 8 November 2016, 2016-November:94-101)
Subject
Language
English
ISSN
10889299