학술논문
Heat, moisture and chemical resistance on low dielectric constant (low-k) film using Diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition
Document Type
Article
Author
Source
In: Surface and Coatings Technology . (Surface and Coatings Technology, 24 February 2006, 200 10 SPEC. ISS.:3127-3133)
Subject
Language
English
ISSN
02578972