학술논문

Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC Packages

Document Type

Article

Author

Chen, C.-H.; Lai, Y.-C.; Lin, C.-Y.; Chang, H.-M.; Chuang, T.-H.; Lin, Y.-C.; Groth, A.

Source

In: IEEE Transactions on Components, Packaging and Manufacturing Technology. (IEEE Transactions on Components, Packaging and Manufacturing Technology, June 2020, 10(6):1061-1068)

Subject

Language

English

ISSN

21563985
21563950

Online Access

Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU

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