학술논문
Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration
Document Type
Article
Author
Source
In: IEEE Transactions on Components, Packaging and Manufacturing Technology . (IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 December 2023, 13(12):2016-2023)
Subject
Language
English
ISSN
21563985
21563950
21563950