학술논문
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz
Document Type
Article
Author
Source
In: IEEE Transactions on Components, Packaging and Manufacturing Technology . (IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, :1-1)
Subject
Language
English
ISSN
21563985
21563950
21563950