학술논문
3DVLSI with CoolCube process: An alternative path to scaling
Document Type
Conference Paper
Author
Batude, P.; Fenouillet-Beranger, C.; Pasini, L.; Lu, V.; Deprat, F.; Brunet, L.; Sklenard, B.; Piegas-Luce, F.; Casse, M.; Mathieu, B.; Billoint, O.; Cibrario, G.; Turkyilmaz, O.; Sarhan, H.; Thuries, S.; Hutin, L.; Sollier, S.; Widiez, J.; Hortemel, L.; Tabone, C.; Samson, M.-P.; Previtali, B.; Rambal, N.; Ponthenier, F.; Mazurier, J.; Rozeau, O.; Euvard-Colnat, C.; Seignard, A.; Fournel, F.; Benaissa, L.; Leduc, P.; Hartmann, J.-M.; Kerdiles, S.; Bout, C.; Nemouchi, F.; Royer, A.; Agraffeil, C.; Signamarcheix, T.; Clermidy, F.; Faynot, O.; Vinet, M.; Beneyton, R.; Bidaud, M.; Josse, E.; Petitprez, E.; Rivoire, M.; Coudrain, P.; Besson, P.; Haond, M.; Ghibaudo, G.
Source
In: Digest of Technical Papers - Symposium on VLSI Technology , 2015 Symposium on VLSI Technology, VLSI Technology 2015 - Digest of Technical Papers. (Digest of Technical Papers - Symposium on VLSI Technology, 25 August 2015, 2015-August:T48-T49)
Subject
Language
English
ISSN
07431562