학술논문
Assessment of solder paste technology limitation at miniaturization for SIP and SMT application
Document Type
Conference Paper
Author
Source
In: 18th International Conference on Electronic Packaging Technology, ICEPT 2017 , 18th International Conference on Electronic Packaging Technology, ICEPT 2017. (18th International Conference on Electronic Packaging Technology, ICEPT 2017, 19 September 2017, :1685-1692)
Subject
Language
English