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Electromigration in Sn-Cu intermetallic compounds

Document Type

Article

Author

Wei, C.C.; Chen, C.F.; Liu, P.C.; Chen, C.

Source

In: Journal of Applied Physics. (Journal of Applied Physics, 2009, 105(2))

Subject

Language

English

ISSN

00218979

Online Access

Full Text (AIP) Web of Science JCR 저널정보 Scopus Find it@PNU

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