학술논문
Impact of mechanical simulation methodology on electronic package reliability assessment with applications to 3D TSS technology
Document Type
Conference Paper
Author
Source
In: 43rd International Symposium on Microelectronics 2010, IMAPS 2010 , 43rd International Symposium on Microelectronics 2010, IMAPS 2010. (43rd International Symposium on Microelectronics 2010, IMAPS 2010, 2010, :170-175)
Subject
Language
English