학술논문
Use of the "Via-in-Pad" method to ensure the high-density layout of the conductive pattern when designing multilayer switching structures
Document Type
Article
Source
In: International Journal on Advanced Science, Engineering and Information Technology . (International Journal on Advanced Science, Engineering and Information Technology, 2020, 10(3):1176-1183)
Subject
Language
English
ISSN
24606952
20885334
20885334