학술논문
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module with Polymer Nanocomposite Field-Grading Coating
Document Type
Article
Author
Source
In: IEEE Transactions on Components, Packaging and Manufacturing Technology . (IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 May 2024, 14(5):776-783)
Subject
Language
English
ISSN
21563985
21563950
21563950