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A microfabricated, 3D-sharpened silicon shuttle for insertion of flexible electrode arrays through dura mater into brain

Document Type

Article

Author

Joo, H.R.; Chung, J.E.; Liang, H.; Geaghan-Breiner, C.; Roumis, D.K.; Liu, D.F.; Frank, L.M.; Fan, J.L.; Pebbles, J.A.; Yorita, A.M.; Tooker, A.C.; Haque, R.; Chen, S.; Tolosa, V.M.

Source

In: Journal of Neural Engineering. (Journal of Neural Engineering, 29 October 2019, 16(6))

Subject

Language

English

ISSN

17412552
17412560

Online Access

Full Text (IOP Science) Full Text (IOP) Web of Science JCR 저널정보 Scopus Find it@PNU

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