학술논문
Three dimensional computerized tomography X-ray Technique for Package Level Analysis
Document Type
Conference Paper
Author
Source
In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA , 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2017. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 5 October 2017, 2017-July:1-4)
Subject
Language
English