학술논문

Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach
Document Type
Conference Paper
Source
In: Proceedings - Electronic Components and Technology Conference, Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. (Proceedings - Electronic Components and Technology Conference, 2021, 2021-June:2009-2015)
Subject
Language
English
ISSN
05695503