학술논문
Low temperature (<180°C) wafer-level and chip-level In-to-Cu and Cu-to-Cu bonding for 3D integration
Document Type
Conference Paper
Author
Source
In: Proceedings - Electronic Components and Technology Conference , 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. (Proceedings - Electronic Components and Technology Conference, 2013, :1146-1152)
Subject
Language
English
ISSN
05695503