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Quasi-direct Cu–Si3N4 bonding using multi-layered active metal deposition for power-module substrate

Document Type

Article

Author

Tatsumi, H.; Takahashi, M.; Kozawa, T.; Nishikawa, H.; Moon, S.; Tsushima, E.

Source

In: Materials and Design. (Materials and Design, February 2024, 238)

Subject

Language

English

ISSN

18734197
02641275

Online Access

Full Text (ScienceDirect 종량제) Full Text (ScienceDirect O/A) Web of Science JCR 저널정보 Scopus Find it@PNU

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