학술논문
Measurement Process Optimization in Using Lock-in Thermography for Fault Localization of CoWos Packages
Document Type
Conference Paper
Source
In: 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021 , 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021)
Subject
Language
English