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Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Document Type

Article

Author

Karve, G.; Motsnyi, V.; Wei, W.; Visker, J.; Chancerel, F.; Ackaert, J.; Puybaret, R.; Dutta, B.; Sabuncuoglu Tezcan, D.; Peng, L.; Soussan, P.; Severi, S.; Osman, H.; Li, Y.

Source

In: Japanese Journal of Applied Physics. (Japanese Journal of Applied Physics, 1 April 2024, 63(4))

Subject

Language

English

ISSN

13474065
00214922

Online Access

Web of Science JCR 저널정보 Scopus Find it@PNU

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