학술논문
TSV Integration With Chip Level TSV-to-Pad Cu/SiO Hybrid Bonding for DRAM Multiple Layer Stacking
Document Type
Article
Author
Source
In: IEEE Electron Device Letters . (IEEE Electron Device Letters, 1 July 2023, 44(7):1176-1179)
Subject
Language
English
ISSN
15580563
07413106
07413106