학술논문
Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heating
Document Type
Article
Author
Source
In: Journal of Materials Research and Technology . (Journal of Materials Research and Technology, 1 March 2022, 17:1438-1449)
Subject
Language
English
ISSN
22387854