학술논문
Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform
Document Type
Article
Author
Source
In: Journal of Materials Science: Materials in Electronics . (Journal of Materials Science: Materials in Electronics, July 2024, 35(19))
Subject
Language
English
ISSN
1573482X
09574522
09574522