학술논문

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
Document Type
Conference Paper
Source
In: Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022, Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022. (Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022, 2022)
Subject
Language
English