학술논문
EVALUATION of MECHANICAL RELIABILITY of MICRO BUMP in SEMICONDUCTORS through A SHEAR TEST
Document Type
Conference Paper
Author
Source
In: Proceedings of the ASME 2021 30th Conference on Information Storage and Processing Systems, ISPS 2021 , Proceedings of the ASME 2021 30th Conference on Information Storage and Processing Systems, ISPS 2021. (Proceedings of the ASME 2021 30th Conference on Information Storage and Processing Systems, ISPS 2021, 2021)
Subject
Language
English