학술논문
Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3 N4 composite solder
Document Type
Conference Paper
Author
Source
In: 2nd International Conference on Sustainable Materials (ICoSM 2013) . (Advanced Materials Research, 2013, 795:522-525)
Subject
Language
English
ISSN
10226680