학술논문
Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and Beyond
Document Type
Conference Paper
Author
Thareja, G.; Pal, A.; Ma, Q.; Ching, C.; Patel, S.; Gao, X.; Dag, S.; Qi, Z.; Zhang, A.; Yue, S.; Lei, W.; Xu, Y.; Lei, Y.; Jiang, H.; You, S.; Zheng, W.; Hung, R.; Costrini, G.; Zhu, Q.; Tran, R.; Gupta, R.; Reddy, V.; Vyas, P.B.; Hassan, S.; Cai, M.P.; Shen, G.; Chen, Z.; Hou, W.; Lei, J.; Wang, R.; Shen, W.; Deshpande, S.; Huey, S.; Tang, J.; Naik, M.; Kesapragada, S.; Ayyagari-Sangamali, B.; Bazizi, E.M.; Tang, X.
Source
In: Technical Digest - International Electron Devices Meeting, IEDM , 2023 International Electron Devices Meeting, IEDM 2023. (Technical Digest - International Electron Devices Meeting, IEDM, 2023)
Subject
Language
English
ISSN
01631918