학술논문
BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond
Document Type
Conference Paper
Author
Thareja, G.; Pal, A.; Wang, X.; Dag, S.; You, S.; Sharma, S.; Zhu, Q.; Cervantes, C.L.; Hwang, S.; Spuller, M.; Ng, B.; Kumar, P.S.; Tam, N.; Gage, M.; Deshpande, S.; Wu, Z.; Jansen, A.; Dey, L.; Chen, F.; Xie, X.; Kashefizadeh, K.; Reddy, V.; Lo, A.; Chen, Z.; Huey, S.; Tang, J.; Ren, H.; Naik, M.; Brown, B.; Kesapragada, S.; Ayyagari-Sangamali, B.; Bazizi, E.M.; Tang, X.
Source
In: Digest of Technical Papers - Symposium on VLSI Technology , 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023. (Digest of Technical Papers - Symposium on VLSI Technology, 2023, 2023-June)
Subject
Language
English
ISSN
07431562