학술논문
Through-polymer-via for 3D heterogeneous integration and packaging
Document Type
Conference Paper
Author
Source
In: Proceedings of the Electronic Packaging Technology Conference, EPTC , 2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015. (Proceedings of the Electronic Packaging Technology Conference, EPTC, 17 February 2016, 2016-February)
Subject
Language
English