학술논문
Analysis of thermal vias in molded interconnect devices
Document Type
Conference Paper
Author
Source
In: Proceedings of SPIE - The International Society for Optical Engineering , Smart Sensors, Actuators, and MEMS VI. (Proceedings of SPIE - The International Society for Optical Engineering, 2013, 8763)
Subject
Language
English
ISSN
0277786X
1996756X
1996756X