학술논문
An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s
Document Type
Article
Author
Source
In: IEEE Journal of Solid-State Circuits . (IEEE Journal of Solid-State Circuits, 1 November 2023, 58(11):3242-3252)
Subject
Language
English
ISSN
1558173X
00189200
00189200