학술논문
Multi-Physics Simulation of Wafer-to-Wafer Bonding Dynamics
Document Type
Conference Paper
Author
Source
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. (Proceedings - Electronic Components and Technology Conference, 2022, 2022-May:502-506)
Subject
Language
English
ISSN
05695503