학술논문
Impact of interlevel dielectric materials on stress-induced voiding of metal 1
Document Type
Conference Paper
Author
Source
In: Proceedings of SPIE - The International Society for Optical Engineering , Submicrometer Metallization: Challenges, Opportunities, and Limitations. (Proceedings of SPIE - The International Society for Optical Engineering, 21 May 1993, 1805:164-168)
Subject
Language
English
ISSN
1996756X
0277786X
0277786X