학술논문
Understanding the role of additional Cu intercalation in electronic and thermal properties of p-type Cu2.9 Te2 -incorporated Bi0.5 Sb1.5 Te3 thermoelectric alloys
Document Type
Article
Author
Source
In: Journal of Alloys and Compounds . (Journal of Alloys and Compounds, 15 August 2024, 995)
Subject
Language
English
ISSN
09258388