학술논문

Design and Fabrication of Nonplanar Yagi–Uda Antennas Based on a Partially Conductive Filling Method
Document Type
Periodical
Source
IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 18(11):2439-2443 Nov, 2019
Subject
Fields, Waves and Electromagnetics
Yagi-Uda antennas
Antenna measurements
Fabrication
Dipole antennas
Filling
Substrates
High antenna gain
partially-filled vias
Yagi–Uda antenna
Language
ISSN
1536-1225
1548-5757
Abstract
In this letter, a rapid and easy fabrication approach of nonplanar Yagi–Uda antennas is presented. The presented nonplanar Yagi–Uda antenna has a three-layer configuration and consists of several fully and partially-filled vias including one pair of radiator vias, two partially-filled reflector vias, and two partially-filled director vias. All vias are fully or partially filled by the silver conductive polymer (silver conductive epoxy, or SCE). This new partial filling scenario is realized by squeezing a certain amount of SCE in the vias using an accurate pipette. A nonplanar Yagi–Uda antenna prototype is designed and fabricated to work within the X-band. A good agreement is achieved between the measured and simulated results, which confirms the reliability and robustness of this fabrication approach. The measurement results show that for a Yagi–Uda antenna with just two directors, a gain of 10.2 dBi is achieved.