학술논문
Conductor architecture, filamentary interconnections and current distribution in BiSCCO-2223-based tape conductors
Document Type
Periodical
Source
IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 11(1):2788-2791 Mar, 2001
Subject
Language
ISSN
1051-8223
1558-2515
2378-7074
1558-2515
2378-7074
Abstract
The transport properties of superconducting interconnections in multifilamentary Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub 10//Ag-alloy tapes are analyzed. A simple experimental procedure is developed to assess the interconnections in a direct and quantitative way. Distinct behavior was observed for tapes produced in different conditions. Results of the transport measurements are consistent with the tape microstructure.