학술논문

Design of LTCC package for DGS LPF switch
Document Type
Conference
Source
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE. :1-3 Dec, 2017
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Fields, Waves and Electromagnetics
Packaging
Pins
Insertion loss
Flip-chip devices
Low pass filters
Electronic packaging thermal management
Reliability
component
formatting
style
styling
Language
ISSN
2151-1233
Abstract
This paper presents the design of LTCC-based packages for CMOS-based defected ground structure (DGS) low pass filter (LPF) single-pole single-throw (SPST) and single-pole double-throw (SPDT) switches. The packaged SPST switch can operate from DC to 20 GHz with an insertion loss less than 1 dB, return loss large than 10 dB, and isolation larger than 15 dB. The packaged SPDT switch can operate from DC to 16 GHz with an insertion loss less than 2 dB, return loss large than 15 dB, and isolation larger than 30 dB.