학술논문

Word-line architecture for highly reliable 64-Mb DRAM
Document Type
Periodical
Source
IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 27(4):603-609 Apr, 1992
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Computing and Processing
Random access memory
Fluctuations
Voltage control
Threshold voltage
Degradation
Dielectric breakdown
Breakdown voltage
Leakage current
Ultra large scale integration
Language
ISSN
0018-9200
1558-173X
Abstract
A unique word-line voltage control method for the 64-Mb DRAM and beyond is proposed. It realizes a constant lifetime for a thin gate oxide. This method controls word-line voltage and compensates reliability degradation in the thin gate oxide for cell-transfer transistors. It keeps the time-dependent dielectric breakdown (TDDB) lifetime constant under any conditions of gate oxide thickness fluctuation, temperature variation, and supply voltage variation. This method was successfully implemented in a 64-Mb DRAM to realize high reliability. This chip achieved a 10/sup 5/ times reliability improvement and a 0.3 approximately 1.8-V larger word-line voltage margin to write ONE data into the cell.ETX