학술논문

PinPoint: An SMD Pin Localization Method
Document Type
Conference
Source
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-8 Jul, 2022
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Location awareness
Performance evaluation
Integrated optics
Printed circuits
Optical materials
Pins
Automatic optical inspection
Automated Optical Inspection
hardware assurance
computer vision
Bill of Materials
Language
ISSN
1946-1550
Abstract
Automated optical inspection (AOI) is used to verify quality of printed circuit board (PCB) assembly and has been proposed for detecting counterfeit components and malicious "trojan" PCB modifications. Component pin localization and characterization is an important step in both of these processes. We present PinPoint: a computer vision algorithm which extracts pin information from surface-mount device (SMD) contours. PinPoint is robust against contour noise, component size, and package type. We evaluate PinPoint against a sample of SMD contours and show that it achieves remarkable performance. Our algorithm could serve as an efficient pin localization step in traditional assembly quality checks and can support future efforts to extract expensive-to-forge characteristics of SMD packages to improve optical assurance.