학술논문

Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems
Document Type
Conference
Source
2013 23rd International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS) Power and Timing Modeling, Optimization and Simulation (PATMOS), 2013 23rd International Workshop on. :227-230 Sep, 2013
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Power, Energy and Industry Applications
Finite element analysis
Impedance
Silicon germanium
Thermal conductivity
Resistance heating
Standards
compact thermal modeling
electrical macromodeling
silicon germanium (SiGe)
silicon on glass (SOG)
thermal feedback
thermal impedance
Language
Abstract
The applicability of classical macromodeling techniques to dynamic electrothermal analysis is reviewed, with emphasis on specific aspects of the Fourier heat conduction problem. Modeling based on the characterization of thermal multiports is considered, and the identification of corresponding thermal impedances in frequency and time domain is discussed, along with the synthesis of electrical equivalents well suited for standard circuit simulators like SPICE. The presented approach is illustrated through relevant case-studies, namely, two basic analog electronics circuits in state-of-the-art bipolar technologies.