학술논문
Time domain dynamic electrothermal macromodeling for thermally aware integrated system design
Document Type
Conference
Source
2013 17th IEEE Workshop on Signal and Power Integrity Signal and Power Integrity (SPI), 2013 17th IEEE Workshop on. :1-4 May, 2013
Subject
Language
Abstract
Time domain identification of reduced dynamic thermal models is pursued with well established macromodeling techniques, providing electrical equivalents to be integrated in standard circuit simulators. Self and mutual thermal impedances of electronic structures, preliminarily evaluated through accurate 3-D FEM thermal simulations, are directly identified with Time Domain Vector Fitting and synthesised in a lumped PSPICE circuit. Two relevant examples of dynamic electrothermal co-simulation are given, the results of which exhibit significant differences with respect to their isothermal counterparts.