학술논문
Device processing technology for free-space optical interconnect system
Document Type
Conference
Author
Source
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :886-889 2001
Subject
Language
ISSN
0569-5503
Abstract
A device processing technology was developed for fabricating arrays of detector/modulator chips used in a free-space optical interconnect system. The arrays are fabricated onto a GaAs/AlGaAs multi quantum well (MQW) epitaxial layer having an in-plane anisotropic strain. The packaged module array consists of a strain inducing substrate onto which the GaAs epitaxial layer is transferred, and bonded to a Si CMOS driver by flip chip technology. The module is attached to a printed circuit board (PCB), and two such boards were mounted into a free space optical interconnect demonstration system.