학술논문
3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance
Document Type
Conference
Author
Source
2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2011 Proceedings of the European. :127-130 Sep, 2011
Subject
Language
ISSN
1930-8876
2378-6558
2378-6558
Abstract
This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.