학술논문
Effect of molding compound thermal conductivity on thermal performance of molded multi-chip modules
Document Type
Conference
Author
Source
[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE. :19-27 1993
Subject
Language
Abstract
Exploratory work has been carried out to investigate filled epoxy systems for thermal management enhancements for plastic encapsulated integrated circuits. A computational study was conducted to examine the effect of molding compound thermal conductivity on thermal resistance of a molded multi-chip module. Seven different molding thermal conductivities were considered. The air velocity was varied from natural convection to high-velocity forced convection. The results showed that an eight-fold increase in molding compound thermal conductivity reduces the junction-to-ambient thermal resistance by 20% in natural convection and by 54% in high-velocity forced convection.ETX