학술논문

Contribution of Latent Defects Induced by High-Energy Heavy Ion Irradiation on the Gate Oxide Breakdown
Document Type
Periodical
Source
IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 56(4):2213-2217 Aug, 2009
Subject
Nuclear Engineering
Bioengineering
Electric breakdown
Annealing
MOS devices
Stress
Leakage current
Ionizing radiation
Atomic force microscopy
Satellites
Electron traps
Atomic layer deposition
Device lifetime
heavy ion
latent defects
post gate stress
reliability
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structural modifications
Language
ISSN
0018-9499
1558-1578
Abstract
From annealing and electrical stress experiments performed on irradiated MOS devices, swift energetic ions-induced morphological oxide defects are shown to act as a contributing part of the oxide breakdown occurring during post gate stress, without being possibly electrically detected before the onset of breakdown itself. A reduction of the charge to breakdown and an increase of the radiation-induced leakage current were first observed after irradiation. Then, leakage current has been shown to be fully removable using isochronal annealing while charge to breakdown was not increased back to its initial value.