학술논문

Low-Power Resistive Memory Integrated on III–V Vertical Nanowire MOSFETs on Silicon
Document Type
Periodical
Source
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 41(9):1432-1435 Sep, 2020
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Logic gates
Switches
Ions
Random access memory
Electrodes
MOSFET
Metals
Resistive random access memory (RRAM)
1T1R
ITO
vertical nanowire
InAs
InGaAs
gate-all-around MOSFET
Language
ISSN
0741-3106
1558-0563
Abstract
III-V vertical nanowire MOSFETs (VNW-FETs) have the potential to extend Moore’s law owing to their excellent material properties. To integrate highly scaled memory cells coupled with high performance selectors at minimal memory cell area, it is attractive to integrate low-power resistive random access memory (RRAM) cells directly on to III-V VNW-FETs. In this work, we report the experimental demonstration of successful RRAM integration with III-V VNW-FETs. The combined use of VNW-FET drain metal electrode and the RRAM bottom electrode reduces the process complexity and maintains material compatibility. The vertical nanowire geometry allows the RRAM cell area to be aggressively scaled down to $0.01~\mu ^{m2}$ enabling realization of dense memory (1T1R) cross-point arrays on silicon.