학술논문

Photoacoustic elastic bending method: Investigation of the surface recombination states
Document Type
Conference
Source
2008 26th International Conference on Microelectronics Microelectronics, 2008. MIEL 2008. 26th International Conference on. :561-564 May, 2008
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Surface treatment
Signal processing
Mechanical variables measurement
Frequency measurement
Phase measurement
Phase modulation
Amplitude modulation
Frequency modulation
Signal analysis
Spontaneous emission
Language
Abstract
The recombination processes of surface modified Si samples by the PA elastic bending method were investigated. The experimental PA elastic bending signals were measured by using special constructed PA cell (the gas-microphone detection technique with transmission configuration) where the sample is mechanically clamped on the edge. The PA amplitude and phase spectra were measured and analyzed, as a function of the modulation frequency for different surface quality of Si wafer. The samples were the disks of intact wafers of Si with different thicknesses, and discs with mechanically treated surfaces. The experimental results and theoretical analyze showed a strong dependence of the PA elastic bending signal due the recombination processes on the surface defect states. These results show a clear influence of the process of the surface modification on the thermodiffusion, thermoelastic and electronic deformation mechanisms of the PA elastic bending signal.