학술논문
Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Document Type
Conference
Author
Source
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2015 21st International Workshop on. :1-7 Sep, 2015
Subject
Language
Abstract
In this paper, a cooling concept for power electronics is discussed, using thermo-electric cooling in combination with a phase-change based latent heat storage module. It was designed to cope with thermal transients due to periodic overload operation phases of an IGBT power converter module. Several sub-system simulations and experiments have already been performed in previous publications leading to the current design state, which is now being tested under emulated experimental conditions. Very good results are presented, showing the feasibility of the transient cooling concept. On-going work referred to the long-term thermal stability and operation as well as a smart electrical TEC control will be motivated.