학술논문

Analysis of Electromagnetic Noise From Switching Power Modules Using Wide Band Gap Semiconductors
Document Type
Periodical
Source
IEEE Letters on Electromagnetic Compatibility Practice and Applications IEEE Lett. on Electromagn. Compat. Pract. and Appl. Electromagnetic Compatibility Practice and Applications, IEEE Letters on. 4(4):92-96 Dec, 2022
Subject
Fields, Waves and Electromagnetics
Engineered Materials, Dielectrics and Plasmas
DC-DC power converters
Gallium nitride
Electromagnetic interference
Frequency measurement
Mobile communication
Power semiconductor devices
Noise measurement
DC–DC power conversion
electromagnetic interference (EMI)
mobile communication
noise measurements
power semiconductor devices
Language
ISSN
2637-6423
Abstract
Wide band gap (WBG) semiconductors, such as gallium nitride (GaN), have become popular among switching power modules. In pursuing power conversion efficiency, power module’s high-speed and high-power operation leads to electromagnetic (EM) noise in a very wide frequency range, potentially interfering with nearby wireless communications [e.g., long-term evolution (LTE)]. This letter analyzes the source of EM noise from the power modules using GaN transistors in half-bridge circuits. EM noise was clearly observed in the proximity of power modules and attributed to two primary sources in the frequency range of interest up to 6 GHz: 1) the periodical switching operation of GaN transistors in the output stage and 2) the logic operation of complementary metal–oxide–semiconductor digital circuits to control gate drivers, in the lower and upper side of frequencies, respectively. Measurements analyzed the EM noise characteristics at different probing locations over the assembly of two GaN power modules as well as in different operating conditions by strategically supplying source signals. The influence of EM noise on LTE receiver performance is evaluated with wireless system-level simulation and related to the degradation of its minimum receivable input power.