학술논문
Annealing temperature dependence of contact resistance and stability for Ti/Al/Pt/Au ohmic contacts to bulk n-ZnO
Document Type
Conference
Author
Source
2003 International Symposium on Compound Semiconductors Compound semiconductors Compound Semiconductors, 2003. International Symposium on. :123-124 2003
Subject
Language
Abstract
Summary form only given. The authors report on the annealing temperature dependence of contact resistance and morphology for Ti/Al/Pt/Au contacts on high-quality, undoped (n/spl sim/10/sup 17/ cm/sup -3/) bulk ZnO substrates. Two different surface cleaning procedures were employed, although it was found that in general the as-received surface produced the lowest specific contact resistances.