학술논문
Reliability behavior of RF MEMS
Document Type
Conference
Author
Source
2003 International Semiconductor Conference. CAS 2003 Proceedings (IEEE Cat. No.03TH8676) Semiconductor conference. CAS 2003 Semiconductor Conference, 2003. CAS 2003. International. 1:21-26 Vol. 1 2003
Subject
Language
Abstract
This paper outlines the reliability properties of RF MEMS devices and circuits. The tools used to evaluate the reliability properties are presented. Results are shown on both moveable and non moveable devices. Key parameters that drive the reliability are pointed out: stress, roughness, temperature dependance, dielectric properties. Finally, it is presented some solutions to improve the reliability performance of these devices in term of technology and design.