학술논문
Are on-chip power-ground planes really needed? A signal integrity perspective
Document Type
Conference
Author
Source
Electrical Performance of Electronic Packaging - 2004 Electronic packaging Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on. :307-310 2004
Subject
Language
Abstract
We use the on-chip bus characterization methodology of to study the impact of the on-chip power distribution system on the signal integrity of a 12-line bus. We compare two power supply systems implemented in the same Cu BEOL stack: an entirely grid-based system and a system similar to in that it contains one metal layer dedicated to V/sub dd/ and one metal layer dedicated to V/sub ss/. We show that while the dedicated power/ground layers do contribute to the mitigation of the inductive and return-path impedance effects, the ultimate signal integrity of the on-chip bus depends on the interplay between resistive losses, electromagnetic couplings (capacitive and inductive), and the driving and receiving circuitry.